PHIX takes big step in integrated photonics and MEMS packaging business with move and further scale up to volume production

With 1800 square meters of floor space and up to ISO 5 clean rooms, PHIX’s new facility has sufficient space and infrastructure to accommodate their ever-growing team and state-of-the-art equipment for volume manufacturing of optoelectronic modules based on photonic integrated circuits (PICs) and microelectromechanical systems (MEMS). One example of the new equipment they will house here is the ASMPT Amicra Nano die bonder and flip chip tool, which arrives in September.

This new facility not only supports their own growth and expansion, but will also enable further industrialization of their global customers’ innovations, advancing the photonic chip industry as a whole.