Following the reorganization of ESSDERC & ESSCIRC into a combined conference, the second edition of the European Solid-State Electronics Research Conference (ESSERC) was successfully held last year in Bruges, Belgium. The third edition will take place next year in Munich, Germany.

The aim of ESSERC is to provide an annual European forum for presenting and discussing recent advances in solid-state devices and circuits. The level of integration in system-on-chip design is rapidly increasing, driven by advances in semiconductor technology. As a result, deeper interaction among technologists, device experts, IC designers, and system designers is more critical than ever before.

ESSERC 2025 will take place from September 8 to 11, 2025, at TUM’s historic Main Campus in Maxvorstadt, a central urban district of Munich. The Faculty of Electrical and Computer Engineering is located here, within walking distance of numerous internationally renowned museums, galleries, theaters, and other attractions.

​The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

CONFERENCE HIGHLIGHTS

• Insightful Keynote presentations by distinguished speakers from industry and academia
• Industry Session on “Fabs in Europe”
• Focus Session with coverage of special topics of devices and circuits
• Presentation of IEEE and ESSERC Awards
• ESSERC Gala Dinner on Wednesday, September 10, 2025
• Tutorials and Workshops

The venue of the conference events, including workshops and tutorials, will be in the center of Munich (TUM City Center Campus, Arcisstraße 21, 80333 Munich – Germany).

The working language of the conference is English.

More information: esserc2025.org