Metrology & Inspection for Yield Improvement

As semiconductor technologies become increasingly complex as we move from monolithic to chiplet-based chip design, the ability to measure, inspect and understand what happens across processes, materials and interfaces is becoming critical to achieving higher yield.

On 25 November, the ChipNL Competence Centre brings together leading experts from industry, research and the semiconductor value chain for a focused Tech Deep Dive on metrology and inspection for yield improvement in heterogeneous integration.

In an expert setting we will explore emerging technologies, breakthrough innovations and the challenges that need to be addressed to strengthen Europe’s semiconductor capabilities.

Topics will include:

• Strengthening resilience and capabilities across the European semicon value chain
• Metrology & inspection as key enablers for yield improvement in hybrid bonding
• Emerging enabling technologies and breakthrough innovations for heterogenous integration
• Expert exchange and networking across industry and research

Expect technical insights, forward-looking discussions and new connections across the semiconductor ecosystem.

Save the date: 25 November 2026

Register here for updates on this event.

More details on speakers and the programme will follow.