Chip Design And Advanced Packaging: Your Chip Design From Scratch To Integration

Chip Design And Advanced Packaging: Your Chip Design From Scratch To Integration

Date
15-06-2023
Time
12:00 - 18:00
Location
Building M, Noviotech Campus, Nijmegen

Chip Design And Advanced Packaging: Your Chip Design From Scratch To Integration

15 June 2023 at Building M, Noviotech Campus, Nijmegen

This June, leading lights from the Dutch chip design industry will reconvene for another invitation-only networking and knowledge sharing event: Chip Design And Advanced Packaging: Your Chip Design From Scratch To Integration.

The event takes place at Nijmegen – widely considered to be the epicenter of the Netherlands’ chip industry since the 1950s. It’s a joint collaboration between Brainport Eindhoven, ChipTech Twente, Chip Integration Technology Center, High Tech NL Cluster Semiconductors, Oost NL, and PhotonDelta.

On the day, we’ll go deep into chip design and advanced packaging. Previous events in the series covered micro-electronics, heterogeneous systems, and building a community of chip design companies based in the Netherlands.

This is your chance to help shape the Dutch chip design industry alongside leading technical universities and ecosystems. Join internationally-renowned scientists, academics, and industry leaders as we build on the success of our previous meetings.

You’ll also get the opportunity to tour either the Chip Integration Technology Center (CITC) or Sencio — an advanced packaging and assembly company. Sign up on-site to register.

We look forward to welcoming you on 15 June at Noviotech Campus, Nijmegen!

For more information press the following link.

Contact

Program Office
ChipTech Twente
T: +31 (0)6 42 11 07 39
contact@chiptechtwente.com

 

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